Fragmentation and adhesion properties of Cu-Zr amorphous thin films on polyimide substrates. (3rd October 2018)

• Record Type: Journal Article
• Authors: Wu, K.; Wang, Y. Q.; Yuan, H. Z.; Zhang, J. Y.; Liu, G.; Sun, J.
• Is Part Of: Philosophical magazine letters. Volume 98:Number 10(2018)
• Page Start: 464
• Page End: 472
• Publication Date: 2018-10-03
• Subjects: Cu-Zr amorphous films -- fragmentation -- adhesion energy -- film thickness effects; Condensed matter -- Periodicals; Physics -- Periodicals; Solid state physics -- Periodicals; Physique -- Périodiques; 530.41
• DOI: 10.1080/09500839.2019.1575529
• Languages: English
• ISSNs: 0950-0839

Abstract

ABSTRACT: The fragmentation of Cu75 Zr25 amorphous films with varying film thickness( h ) on polyimide substrates has been investigated by uniaxial tensile testing, in combination with in situ electrical resistivity measurements, optical microscopy and atomic force microscopy. It is revealed that the cracking strain monotonically increases ash decreases, which can be attributed to the constraint effect of film thickness on shear band formation and the columnar structures in the thicker films. Similarly, the buckling strain also increases with decreasingh, with the delamination of Cu75 Zr25 amorphous films following the strain energy criterion. The adhesion energy between Cu75 Zr25 film and polyimide is estimated to be of ∼ 6.5 J m −2 based on the buckle geometry.