Anchoring an Artificial Solid–Electrolyte Interphase Layer on a 3D Current Collector for High‐Performance Lithium Anodes. Issue 7 (16th January 2019)

• Record Type: Journal Article
• Authors: Li, Panlong; Dong, Xiaoli; Li, Chao; Liu, Jingyuan; Liu, Yao; Feng, Wuliang; Wang, Congxiao; Wang, Yonggang; Xia, Yongyao
• Is Part Of: Angewandte Chemie international edition. Volume 58:Issue 7(2019)
• Page Start: 2093
• Page End: 2097
• Publication Date: 2019-01-16
• Subjects: 3D copper foam -- lithium anodes -- lithium plating/stripping -- LLZTO -- solid–electrolyte interfaces; Chemistry -- Periodicals; 540
• DOI: 10.1002/anie.201813905
• Languages: English
• ISSNs: 1433-7851

Abstract

Abstract: The application of Li anodes is hindered by dendrite growth and side reactions between Li and electrolyte, despite its high capacity and low potential. A simple approach for this challenge is now demonstrated. In our strategy, the garnet‐type Li6.4 La3 Zr1.4 Ta0.6 O12 (LLZTO)‐based artificial solid–electrolyte interphase (SEI) is anchored on Cu foam by sintering the Cu foam coated with LLZTO particles. The heat treatment leads to the interdiffusion of Cu and Ta2 O5 at the Cu/LLZTO interface, through which LLZTO layer is fixed on Cu foam. 3D structure lowers the current density, and meanwhile the SEI reduces the contact of Li and electrolyte. Furthermore, the anchoring construction can endure Li‐deposition‐induced volume change. Therefore, LLZTO‐modified Cu foam shows much improved Li plating/stripping performance, including long lifespan (2400 h), high rate (maximum current density of 20 mA cm −2 ), high areal capacity (8 mA h cm −2 for 100 cycles), and high efficiency (over 98 %). Abstract : 3D copper anchored with an artificial solid–electrolyte interface (SEI) layer is proposed for Li‐plating. The anchoring construction of 3D copper and SEI layer can lower current density, provide buffer space, reduce lithium/electrolyte contact, and endure Li‐deposition‐induced volume change, leading to high‐performance lithium anode with long lifespan, high rate, high area capacity, and high efficiency.