3D Heterostructured Copper Electrode for Conversion of Carbon Dioxide to Alcohols at Low Overpotentials. (1st July 2018)

• Record Type: Journal Article
• Authors: Daiyan, Rahman; Saputera, Wibawa Hendra; Zhang, Qingran; Lovell, Emma; Lim, Sean; Ng, Yun Hau; Lu, Xunyu; Amal, Rose
• Is Part Of: Advanced sustainable systems. Volume 3:Number 1(2019)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2018-07-01
• Subjects: CO2 reduction -- copper -- ethanol -- heterostructures -- methanol; Sustainable living -- Periodicals; Sustainability -- Periodicals; Green technology -- Periodicals; Periodicals; 628
• DOI: 10.1002/adsu.201800064
• Languages: English
• ISSNs: 2366-7486

Abstract

Abstract: Active and cost‐effective catalyst materials are required for electrochemical CO2 reduction reactions (CO2 RR) which, to date, are proving elusive. Here, the direct electrochemical conversion of CO2 to liquid products with a high overall Faradaic efficiency (FE) by utilizing a unique 3D, heterostructured copper electrode (referred as Cu sandwich) that is obtained via a simple two‐step treatment of commercially available copper foam is reported. The designed catalyst achieves an FE toward liquid products of >50% at an applied potential as low as −0.3 V versus reversible hydrogen electrode. The improved selectivity of the heterostructured Cu sandwich electrode at low overpotentials is attributed to the greater exposure of engineered Cu + /Cu 2+ interfaces (present on composite nanowires) and higher oxygen vacancy defects. Moreover, the rationally designed heterostructures prevent the Cu2 O species from being reduced during CO2 RR enabling the catalyst to demonstrate enhanced CO2 RR activity with prolonged stability. Abstract : A 3D heterostructured copper electrode (Cu sandwich) for CO2 reduction reactions (CO2 RR) is fabricated by a simple two‐step treatment of commercially available copper foam . The catalyst demonstrates a high selectivity toward ethanol and methanol production during CO2 RR. The improved selectivity of the Cu sandwich can be explained by the presence of Cu + /Cu 2+ interfaces and oxygen vacancy defects.