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HARVARD Citation
Lin, L. et al. (2019). An adhesive bonding approach by hydrogen silsesquioxane for silicon carbide-based LED applications. Materials science in semiconductor processing. pp. 9-12. [Online].
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Lin, L. et al. (2019). An adhesive bonding approach by hydrogen silsesquioxane for silicon carbide-based LED applications. Materials science in semiconductor processing. pp. 9-12. [Online].