Octylphenol ethoxylate surfactant as a suppressor in copper electrodeposition. (2nd January 2019)

• Record Type: Journal Article
• Authors: Kang, Jinseok; Kim, Chan Mi; Yu, Da Yeong; Ham, Yu Seok; Cho, Sung Ki; Kim, Jae Jeong
• Is Part Of: Transactions of the Institute of Metal Finishing. Volume 97:Number 1(2019)
• Page Start: 22
• Page End: 27
• Publication Date: 2019-01-02
• Subjects: Cu electrodeposition -- surfactant -- additive -- Triton X-100 -- PEG -- suppressor -- inhibition -- filling; Metals -- Finishing -- Periodicals; Metals -- Surfaces -- Periodicals; Metallurgy -- Periodicals; 671.705
• DOI: 10.1080/00202967.2019.1551276
• Languages: English
• ISSNs: 0020-2967

Abstract

ABSTRACT: In this study, the role of octylphenol ethoxylate (Triton X-100) surfactant as a suppressor in Cu electrodeposition has been examined. The inhibition ability of Triton X-100 was qualitatively and quantitatively evaluated with cyclic voltammograms and Koutecký–Levich plots, and compared with that of polyethylene glycol (PEG) with similar molecular size. The presence of a hydrophobic benzene-ring in its structure made it inhibit Cu deposition more strongly than PEG. The inhibition function of Triton X-100 depended on the substrate material and it was influenced by the presence of Cl − and bis sulphopropyl disulphide in the electrolyte indicating that the characteristics of Triton X-100 were similar to those of PEG, which was also demonstrated by gap filling of Cu with using Triton X-100 in the replacement of PEG. The effect of Triton X-100 on the properties of the deposit film was also investigated, and it was found that it suppressed the three-dimensional growth of Cu.