Electrodeposition of copper–tin alloys using deep eutectic solvents. (3rd March 2016)

• Record Type: Journal Article
• Authors: Abbott, A. P.; Alhaji, A. I.; Ryder, K. S.; Horne, M.; Rodopoulos, T.
• Is Part Of: Transactions of the Institute of Metal Finishing. Volume 94:Number 2(2016:Mar.)
• Page Start: 104
• Page End: 113
• Publication Date: 2016-03-03
• Subjects: Copper–tin electrodeposition -- Deep eutectic solvents -- Choline chloride -- Alloy phase deposition -- Brightener activity; Metals -- Finishing -- Periodicals; Metals -- Surfaces -- Periodicals; Metallurgy -- Periodicals; 671.705
• DOI: 10.1080/00202967.2016.1148442
• Languages: English
• ISSNs: 0020-2967

Abstract

Abstract : While alloy deposition is a frequently studied topic analysis of the alloy phases formed is a complex and often destructive process. In the current study the complex copper–tin alloy system has been studied in deep eutectic solvents using a variety of electrochemical and surface analysis techniques to determine the mechanism of alloy deposition and composition of deposits. The use of electrochemical quartz crystal microbalance is shown to enable real-time monitoring of alloy composition and the latter is shown to be very dependent upon the concentration of ions in solution. For this system X-ray diffraction was also used to study the phase behaviour of the deposits as a function of solution composition and current density. Finally it was shown for the first time that brighteners used for copper deposition in aqueous solutions also work in ionic liquids.