Cite
HARVARD Citation
BERANGER, M. et al. (2018). A new fatigue model including thermal ageing for low copper aluminum-silicon alloys. Procedia engineering. pp. 720-729. [Online].
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BERANGER, M. et al. (2018). A new fatigue model including thermal ageing for low copper aluminum-silicon alloys. Procedia engineering. pp. 720-729. [Online].