Cite
HARVARD Citation
Youssef, T. et al. (2015). Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity. Microelectronics and reliability. 55 (9), pp. 1997-2002. [Online].
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Youssef, T. et al. (2015). Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity. Microelectronics and reliability. 55 (9), pp. 1997-2002. [Online].