Cite
HARVARD Citation
Jacques, S. et al. (2015). Impact of aluminum wire and ribbon bonding technologies on D2PAK package reliability during thermal cycling applications. Microelectronics and reliability. 55 (9), pp. 1821-1825. [Online].
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Jacques, S. et al. (2015). Impact of aluminum wire and ribbon bonding technologies on D2PAK package reliability during thermal cycling applications. Microelectronics and reliability. 55 (9), pp. 1821-1825. [Online].