Thermally stable Cu3Sn/Cu composite joint for high-temperature power device. (1st January 2016)

• Record Type: Journal Article
• Authors: Liu, Xiangdong; He, Siliang; Nishikawa, Hiroshi
• Is Part Of: Scripta materialia. Volume 110(2016)
• Page Start: 101
• Page End: 104
• Publication Date: 2016-01-01
• Subjects: Bonding -- Composites -- Intermetallic compounds -- Sintering -- Die attach; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2015.08.011
• Languages: English
• ISSNs: 1359-6462

Abstract

Graphical abstract: Abstract: This paper describes a novel transient liquid phase sinter (TLPS) bonding that utilizes Sn-coated micro-sized Cu particles for high-temperature power device packaging. When used as die attach materials for Cu–Cu bonding, a thermally stable joint comprising a Cu3 Sn intermetallic compounds (IMCs) with a dispersion of ductile Cu particles was obtained after bonding at 300 °C for 30 s, and a shear strength equivalent to that of conventional Pb–5Sn solder could be achieved. After isothermal aging at 300 °C for 200 h, the shear strength and microstructure of the bonding joints were almost unchanged.