Cite
HARVARD Citation
Xia, W. et al. (2014). Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurement. Soldering & surface mount technology. 26 (3), pp. 162-171. [Online].
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Xia, W. et al. (2014). Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurement. Soldering & surface mount technology. 26 (3), pp. 162-171. [Online].