Cite
HARVARD Citation
Basaran, C. et al. (2007). Damage mechanics of electromigration in microelectronics copper interconnects. International journal of materials and structural integrity. pp. 16-39. [Online].
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Basaran, C. et al. (2007). Damage mechanics of electromigration in microelectronics copper interconnects. International journal of materials and structural integrity. pp. 16-39. [Online].