Cite
HARVARD Citation
Liang, K. et al. (2019). Comparisons between heat pipe, thermoelectric system, and vapour compression refrigeration system for electronics cooling. Applied thermal engineering. pp. 260-267. [Online].
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Liang, K. et al. (2019). Comparisons between heat pipe, thermoelectric system, and vapour compression refrigeration system for electronics cooling. Applied thermal engineering. pp. 260-267. [Online].