Crack detection in dielectric structures by a linear sampling approach. (1st September 2010)

• Record Type: Journal Article
• Authors: Bozza, G.; Brignone, M.; Pastorino, M.; Piana, M.; , A. Randazzo
• Is Part Of: International journal of signal and imaging systems engineering. Volume 3:Number 2(2010)
• Page Start: 73
• Page End: 80
• Publication Date: 2010-09-01
• Subjects: imaging systems -- nondestructive testing -- NDT -- crack detection -- linear sampling -- inverse scattering -- dielectric structures -- cracks -- defects -- numerical simulation; Signal processing -- Periodicals; Imaging systems -- Periodicals; Information theory -- Periodicals; 621.3822
• Languages: English
• ISSNs: 1748-0698

Abstract

In this paper, a new approach for the detection of cracks and defects inside dielectric structures is presented. The proposed algorithm is based on the Linear Sampling Method (LSM), which is a technique able to find the external shape of unknown objects starting from far-field measurements of the scattered electric field. In particular, in this contribution, the efficient No-Sampling LSM is modified to provide a reconstruction of the positions and shapes of defects located inside a known structure. This task is accomplished by inserting the Green's function of the unperturbed object into the far-field equation. The effectiveness of the approach is assessed by means of numerical simulations.