Modelling and analysis of pad surface topography and slurry particle size distribution effects on material removal rate in chemical mechanical planarisation. (6th September 2005)

• Record Type: Journal Article
• Authors: Wang, Changxue; Sherman, Peter; Chandra, Abhijit
• Is Part Of: International journal of manufacturing technology and management. Volume 7:Number 5/6(2005)
• Page Start: 504
• Page End: 529
• Publication Date: 2005-09-06
• Subjects: chemical mechanical planarisation -- CMP -- material removal rate -- MRR -- pad surface roughness -- slurry particle size distribution -- static models -- dynamic models -- topography evolution -- PDF -- contact mechanics -- stochastic process -- silicon wafers -- semiconductor manufacturing; Manufacturing processes -- Periodicals; Manufacturing processes -- Automation -- Periodicals; Production management -- Periodicals; 670.427068
• Languages: English
• ISSNs: 1368-2148

Abstract

Traditionally, static or steady state models of material removal rate (MRR) in a chemical mechanical planarisation (CMP) process have been developed, and the effects of properties of consumables such as pad or slurry particles on MRR have been investigated. There also exist dynamic or transient models of the CMP process; however, the effect of slurry particle size and distribution is typically neglected in these dynamic models. The present work combines these different approaches by attempting to develop a dynamic model of the CMP process capable of representing MRR decay, which can also account for the effects due to slurry particle size and distribution.