Cite
HARVARD Citation
Ping, Y. et al. (2009). Finite element analysis on stress/strain in CBGA solder joint with different substrates under thermal cycle. International journal of manufacturing technology and management. pp. 333-339. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Ping, Y. et al. (2009). Finite element analysis on stress/strain in CBGA solder joint with different substrates under thermal cycle. International journal of manufacturing technology and management. pp. 333-339. [Online].