Cite
HARVARD Citation
Ping, Y. et al. (2009). Finite Element simulation for three dimensional thermal analysis of Multi-Chip Module. International journal of material & product technology. pp. 241-250. [Online].
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Ping, Y. et al. (2009). Finite Element simulation for three dimensional thermal analysis of Multi-Chip Module. International journal of material & product technology. pp. 241-250. [Online].