Characterisations of interfacial heat transfer by atomic modelling. (15th April 2009)

• Record Type: Journal Article
• Authors: Liao, Ningbo; Ping, Yang
• Is Part Of: International journal of material & product technology. Volume 34:Number 3(2009)
• Page Start: 352
• Page End: 359
• Publication Date: 2009-04-15
• Subjects: molecular dynamics -- heat transfer -- interface -- atomic modelling -- simulation -- interfacial thermal conductivity -- dissimilar materials; Manufacturing processes -- Periodicals; Materials -- Testing -- Periodicals; 620.11
• Languages: English
• ISSNs: 0268-1900

Abstract

An atomic model is proposed for interfacial thermal conductance of dissimilar materials. The simulations results show that the temperature distribution is non-uniform alone the interface, several places corresponding to large temperature difference and sever plastic deformation. By the comparative study, the Cu-Cu interface is built up, it is concluded that the characteristic of atoms' moving alone the interface is caused by dissimilarity of material, which reveal the damage mechanics at the interface in heat transfer. The present atomic model was computationally efficient for interfacial thermal conductance problems. It build a basis for investigation of other interfacial behaviours of dissimilar materials.