Effects of kinematic forms on material removal rate and non-uniformity in chemical mechanical planarisation. (14th January 2008)

• Record Type: Journal Article
• Authors: Wang, C.L.; Jin, Z.J.; Kang, R.K.
• Is Part Of: International journal of material & product technology. Volume 31:Number 1(2008)
• Page Start: 54
• Page End: 62
• Publication Date: 2008-01-14
• Subjects: chemical mechanical planarisation -- kinematic forms -- material removal rate -- non-uniformity -- numerical calculation -- chemical mechanical polishing -- CMP machines -- machine design -- kinematics -- uniformity; Manufacturing processes -- Periodicals; Materials -- Testing -- Periodicals; 620.11
• Languages: English
• ISSNs: 0268-1900

Abstract

Chemical Mechanical Polishing (CMP) machine is the main equipment for ultra-precise plane polishing. Based on the Preston equation, the effects of the kinematic form of the carrier and the variables on the material removal rate and the non-uniformity in the main three kinds of chemical mechanical polishers are analysed in this paper. The results may provide a theoretical reference for design of the CMP machine. It is shown that, the kinematic form of the carrier oscillating along the circle arc orbit has a little better uniformity and material removal rate than the other kinematic forms under the same kinematic parameters. In the same kinematic form, with the increase of the slope angle between the locus and the line between the centre of the locus and the centre of the pad, the material removal rates increase and the non-uniformities decrease in the reciprocation mode and the oscillation mode. When the speed of the carrier equals the speed of the pad, the material removal rate and the uniformity is the best.