Preparation and properties of phenolic resin/graphene oxide encapsulated SiO2 nanoparticles composites. Issue 12 (12th February 2018)

• Record Type: Journal Article
• Authors: Chen, Juan; Zhang, Wenbo; Ge, Heyi; Tan, Juanjuan; Liu, Jianye
• Is Part Of: Polymer engineering & science. Volume 58:Issue 12(2018)
• Page Start: 2143
• Page End: 2148
• Publication Date: 2018-02-12
• Subjects: Polymer engineering -- Periodicals; Polymers -- Periodicals; 668.9
• DOI: 10.1002/pen.24825
• Languages: English
• ISSNs: 0032-3888

Abstract

Abstract : The hybrids of graphene oxide (GO) encapsulated nano‐SiO2 (SiO2 ‐GO) were introduced into phenolic resin (PR) to enhance thermal stability of PR. The effect mechanism was investigated in detail. Through electrostatic self‐assembly method, the SiO2 nanoparticles were evenly distributed onto the surface of GO. This structure could not only prevent the aggregation of nano‐SiO2, but also alleviate the phenomenons of crimp and stack for GO sheets in PR. Nano‐SiO2 and GO showed elaborate synergistic effect on thermal stability of PR. Compared with the pristine PR, the 2 wt% SiO2 ‐GO/PR composite showed higher T 5%, T 10%, and T dmax, which were increased by 65.39, 62.23, and 23.17°C, respectively. And the char yield at 800°C increased from 64.78% to 69.38%. Thus, SiO2 ‐GO hybrids can facilitate the application of PR in the fields of heat insulation and ablation resistance. POLYM. ENG. SCI., 58:2143–2148, 2018. © 2018 Society of Plastics Engineers