Performance of LTCC embedded SiC gas sensors. (2015)

• Record Type: Journal Article
• Authors: Sobocinski, M.; Khajavizadeh, L.; Andersson, M.; Spetz, A. Lloyd; Juuti, J.; Jantunen, H.
• Is Part Of: Procedia engineering. Volume 120(2015)
• Page Start: 253
• Page End: 256
• Publication Date: 2015
• Subjects: LTCC -- SiC -- packaging -- gas sensors; Engineering -- Congresses; Engineering -- Periodicals; Engineering; Conference proceedings; Periodicals; 620.005
• DOI: 10.1016/j.proeng.2015.08.599
• Languages: English
• ISSNs: 1877-7058

Abstract

Abstract: A novel approach to encapsulation/packaging of SiC field effect transistor gas sensors for high temperature applications, such as exhaust and fuel gas emissions monitoring, based on direct co-firing of sensor devices and Low-Temperature Co-fired Ceramics (LTCC) has been investigated. Structural (SEM, EDX, XPS), electrical (I/V, C/V) as well as gas sensing characterization of packaged devices has shown that the "one-step" packaging process forms a hermetic package with retained transducer functionality and gas sensing characteristics without the need for any separate die attachment, (wire) bonding, and/or sealing of the package. Long-term stability testing at elevated temperatures of packaged devices has also shown promising results.