3D interconnected high aspect ratio tellurium nanowires in epoxy nanocomposites: serving as thermal conductive expressway. Issue 6 (12th September 2018)

• Record Type: Journal Article
• Authors: Yan, Changzeng; Yu, Tianhang; Ji, Chao; Zeng, Xiaoliang; Lu, Jibao; Sun, Rong; Wong, Ching‐Ping
• Is Part Of: Journal of applied polymer science. Volume 136:Issue 6(2019)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2018-09-12
• Subjects: epoxy composites -- thermal conductivity -- thermal interfacial resistance -- thermal management; Polymers -- Periodicals; Polymerization -- Periodicals; 668.9
• DOI: 10.1002/app.47054
• Languages: English
• ISSNs: 0021-8995

Abstract

ABSTRACT: Heat removal via thermal management materials is attracting more and more attention in the electronic industry. Conventional particle/polymer thermal conductive composites require a high filler loading ratio (>30 vol %), which cause severe thermal interfacial resistance and mechanical issue. In this work, we fabricate tellurium nanowires (NWs)/epoxy nanocomposites via a facile bar coating method. According to Agari model and Maxwell–Eucken model, the as‐synthesized ultra‐long NWs with high aspect ratio (>100) construct the 3D interconnected thermal conductive network better in resin matrix to facilitate the heat transfer process. The results show that at a low loading ratio of 2.4 vol %, this nanocomposite exhibits the out‐of‐plane and in‐plane thermal conductivity of 0.378 and 1.63 W m −1 K −1, respectively, which is 189 and 715% higher than that of pure epoxy resin. Importantly, good stability, and flexibility of nanocomposites are well maintained. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci.2019, 136, 47054. Abstract : Low loading of Te nanowires based epoxy nanocomposites with high thermal conductivity for thermal interface materials application