Significant improvement of the thermal stability and electrochemical corrosion resistance of the Au/Pd surface finish through catalytic modification. (January 2019)

• Record Type: Journal Article
• Authors: Huang, Y.H.; Yang, S.P.; Lee, P.T.; Kuo, T.T.; Ho, C.E.
• Is Part Of: Corrosion science. Volume 146(2019)
• Page Start: 112
• Page End: 120
• Publication Date: 2019-01
• Subjects: Au/Pd/Cu -- Au/Pd/Au/Cu -- Au nanolayer -- Nanovoid free -- Electrochemical corrosion -- Catalytic modification; Corrosion and anti-corrosives -- Periodicals; 620.11223
• DOI: 10.1016/j.corsci.2018.10.030
• Languages: English
• ISSNs: 0010-938X

Abstract

Graphical abstract: Highlights: Comparative study between Au/Pd (EPIG) and Au/Pd/Au (IGEPIG) surface finishes. Modification of Pd (EP) via replacement of Pd catalysts by a Au nanolayer. Pd (EP) of IGEPIG possessed larger grains with limited nanovoids and nanochannels. A dense Pd film significantly enhanced the thermal reliability and corrosion resistance of Cu. IGEPIG surface finish has better thermal/corrosion properties than EPIG. Abstract: The thermal reliability and electrochemical corrosion of Au/Pd (electroless palladium/immersion gold, EPIG) and Au/Pd/Au (immersion gold/electroless palladium/immersion gold, IGEPIG) surface finishes over Cu traces were characterized in this study. The predeposition of a Au nanolayer over Cu (i.e., IGEPIG case) served as the catalysts for the electroless reduction of Pd 2+ ions and modified the polycrystalline Pd structure (EP) into a dense Pd film with limited grain boundaries and nanochannels/nanovoids. This phenomenon greatly improved the thermal reliability and corrosion resistance of the Au/Pd/Cu structure (EPIG case), even though the predeposited Au film was only 10 nm thick.