Lamination of CuCrO2 thin films to poly methyl methacrylate substrate with boron nitride demolding layer. (November 2018)

• Record Type: Journal Article
• Authors: Lin, Yi-Han; Chiu, Te-Wei; Park, Joon-Hyeong
• Is Part Of: Ceramics international. Volume 44(2018)Supplement 1
• Page Start: S22
• Page End: S25
• Publication Date: 2018-11
• Subjects: Transfer process -- CuCrO2 -- Thin film -- Flexible substrate -- Boron nitride; Ceramics -- Periodicals; Céramique industrielle -- Périodiques; Ceramics; Periodicals; Electronic journals; 666
• DOI: 10.1016/j.ceramint.2018.08.279
• Languages: English
• ISSNs: 0272-8842

Abstract

Abstract: CuCrO2 thin films were prepared on flexible plastic substrate by heat transfer process. Boron nitride (BN) and electrospun CuCrO2 layers were deposited on silicon substrate and used as a demolding layer. Then the CuCrO2 thin film was deposited on the demolding layer by chemical solution deposition and heat treated to form a CuCrO2 /CuCrO2 fiber/BN/Si structure. The CuCrO2 thin film was transferred from the Si substrate to a poly methyl methacrylate (PMMA) substrate. The CuCrO2 /PMMA was characterized by X-ray diffraction and scanning electron microscopy. The resistivity of the CuCrO2 thin films laminated on PMMA substrate was 145 Ω cm, and the transmittance was about 67% in the visible region.