Carbohydrate‐Based Block Copolymer Thin Films: Ultrafast Nano‐Organization with 7 nm Resolution Using Microwave Energy. Issue 35 (6th July 2017)

• Record Type: Journal Article
• Authors: Liao, Yingjie; Chen, Wen‐Chang; Borsali, Redouane
• Is Part Of: Advanced materials. Volume 29:Issue 35(2017)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2017-07-06
• Subjects: block copolymers -- carbohydrates -- microwave radiations -- nanostructured thin films -- self‐assembly; Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adma.201701645
• Languages: English
• ISSNs: 0935-9648

Abstract

Abstract : Block copolymers (BCP) can self‐assemble into nanoscale patterns with a wide variety of applications in the semiconductor industry. The self‐assembly of BCPs is commonly accomplished by solvent vapor or thermal annealing, but generally these methods require long time (few hours) to obtain nanostructured thin films. In this contribution, a new and ultrafast method (using microwaves) is proposed—high temperature solvent vapor annealing (HTSVA), combining solvent vapor annealing with thermal annealing, to achieve fast and controllable self‐assembly of amphiphilic BCP thin films. A promising carbohydrate‐based BCP capable of forming cylindrical patterns with some of the smallest feature sizes is used for demonstrating how to obtain a highly ordered vertical cylindrical pattern with sub‐10 nm feature sizes in few seconds by HTSVA. HTSVA provides not only a simple way to achieve BCP fast self‐assembly in practical applications but also a tool to study the self‐assembly behavior of BCPs under extreme conditions. Abstract : As opposed to solvent or thermal annealing processes (taking few hours), ultrafast (1 s) self‐assembly of high‐χ carbohydrate‐based block copolymers thin films leading to nanoscale patterns (sub‐10 nm perpendicular or horizontal cylinders) is achieved using microwave energy. Such a new technological approach is of great interest for a wide variety of applications in the semiconductor industry.