Gradient nanostructured surface of a Cu plate processed by incremental frictional sliding. Issue 1 (July 2015)

• Record Type: Journal Article
• Authors: Hong, C; Huang, X; Hansen, N
• Is Part Of: IOP conference series. Volume 89:Issue 1(2015)
• Publication Date: 2015-07
• Subjects: Materials science -- Periodicals; 620.1105
• DOI: 10.1088/1757-899X/89/1/012026
• Languages: English
• ISSNs: 1757-8981

Abstract

Abstract: The flat surface of a Cu plate was processed by incremental frictional sliding at liquid nitrogen temperature. The surface treatment results in a hardened gradient surface layer as thick as 1 mm in the Cu plate, which contains a nanostructured layer on the top with a boundary spacing of the order of 100 nm. The boundary spacing increases with increasing distance from the surface, and is accompanied with a decrease in hardness from 2179±31MPa in the topmost surface layer to 568±10 MPa in the undeformed matrix.