Morphological evolution and migration behavior of silver thin films on flexible substrates during thermal cycle testing. (August 2018)

• Record Type: Journal Article
• Authors: Sun, Quan; Lu, Yebo; Xu, Xiaobin; Huang, Fengli; Tang, Chengli
• Is Part Of: Advances in mechanical engineering. Volume 10:Number 8(2018)
• Publication Date: 2018-08
• Subjects: Atomic diffusion -- high-cycle fatigue -- thin structures -- thermal analysis -- stress; Mechanical engineering -- Periodicals; 621.05
• DOI: 10.1177/1687814018795961
• Languages: English
• ISSNs: 1687-8132

Abstract

To understand morphological evolution and migration behavior caused by stress migration and thermal fatigue of silver thin films on flexible substrates, bending tests were conducted with different bending angles for two types of thermal tests. Furthermore, the effect of stress migration and thermal fatigue on the electrical conductivity of the silver thin films was discussed. The experimental samples were silver thin films printed on flexible paper for these tests. In an ultra-low cycle thermal test, the electrical conductivity of a silver film decreased with increasing bending angle because of the occurrence of voids caused by stress migration. Meanwhile, a high-cycle thermal test caused cracks to form and caused further deterioration of the electrical conductivity owing to a combination of stress migration and thermal fatigue.