A thermal resistance network model based on three-dimensional structure. (February 2019) - Han, Lei
Highlights: Thermal resistance network model based on three-dimensional structures. Complete 3-D temperature distribution at arbitrary position. The convection coefficient calculation based on iterative algorithm. Accurate temperature distribution suitable for three-dimensional structures. Abstract: A thermal resistance network model based on three-dimensional structure is proposed in this paper. In a chip package newly developed method (three-dimensional stacked package), the thermal distribution management is essential. In order to improve the thermal design of a chip package structure, a thermal resistance network model of temperature distribution is established based on the thermal resistance network and the principle of spherical wall heat conduction. The principle of spherical wall heat conduction is adopted to calculate the complete 3-D temperature distribution at arbitrary position. For the analysis of the thermal resistance of thermal convection, the convection coefficient is calculated based on iterative algorithm. When the heating power arises from 0.27 W to 2.18 W, the errors between the calculation results and the experimental results are less than 5%. The experimental results validate the calculation results well.