Effects of CuO on constrained sintering of a polycrystalline TiO2 ceramics. Issue 1 (10th July 2018)

• Record Type: Journal Article
• Authors: Lee, Cheng‐Fan; Wu, Cheng‐Feng; Jean, Jau‐Ho
• Is Part Of: Journal of the American Ceramic Society. Volume 102:Issue 1(2019)
• Page Start: 158
• Page End: 166
• Publication Date: 2018-07-10
• Subjects: constrained sintering -- low‐temperature cofired ceramics -- molecular dynamics simulation -- stress development; Ceramics -- Periodicals; 620.1405
• DOI: 10.1111/jace.15897
• Languages: English
• ISSNs: 0002-7820

Abstract

Abstract: Effects of CuO on constrained sintering of a polycrystalline TiO2 ceramics have been investigated. The densification temperature of TiO2 is reduced from 1100‐1200°C for pure TiO2 to 900°C with the presence of 0.5‐3 mol% CuO under free sintering. For the samples with 1 mol% CuO, the constrained densification is slowed down, but a high sintered density of >95% at 950°C, which is close to that sintered freely, is still obtained. The above results are caused by the formation of CuO‐rich film at the grain boundaries, which reduces grain‐boundary energy and enhances grain‐boundary migration kinetics of TiO2 . To confirm the above findings, molecular dynamics simulation, at which the ratio of grain boundary energy of TiO2 between with and without CuO agrees well with that obtained experimentally, is conducted.