Cite
HARVARD Citation
Liu, X. et al. (2016). Thermally stable Cu3Sn/Cu composite joint for high-temperature power device. Scripta materialia. pp. 101-104. [Online].
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Liu, X. et al. (2016). Thermally stable Cu3Sn/Cu composite joint for high-temperature power device. Scripta materialia. pp. 101-104. [Online].