Cite
HARVARD Citation
Kwak, J. et al. (2015). Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effects. Soldering & surface mount technology. 27 (1), pp. 1-6. [Online].
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Kwak, J. et al. (2015). Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effects. Soldering & surface mount technology. 27 (1), pp. 1-6. [Online].