A computational method for evaluating the damage in a solder joint of an electronic package subjected to thermal loads. Issue 3 (28th April 2014)

• Record Type: Journal Article
• Authors: Johansson, Jonas; Belov, Ilja; Johnson, Erland; Leisner, Peter
• Is Part Of: Engineering computations. Volume 31:Issue 3(2014)
• Page Start: 467
• Page End: 489
• Publication Date: 2014-04-28
• Subjects: Computational method -- Thermal fatigue -- Finite element analysis -- Electronic package -- Lead-free solder -- Operating temperature environment; Computer-aided engineering -- Periodicals; Computer graphics -- Periodicals; 620.00285
• DOI: 10.1108/EC-07-2012-0163
• Languages: English
• ISSNs: 0264-4401

Abstract

Abstract : Purpose: – The purpose of this paper is to introduce a novel computational method to evaluate damage accumulation in a solder joint of an electronic package, when exposed to operating temperature environment. A procedure to implement the method is suggested, and a discussion of the method and its possible applications is provided in the paper. Design/methodology/approach: – Methodologically, interpolated response surfaces based on specially designed finite element (FE) simulation runs, are employed to compute a damage metric at regular time intervals of an operating temperature profile. The developed method has been evaluated on a finite-element model of a lead-free PBGA256 package, and accumulated creep strain energy density has been chosen as damage metric. Findings: – The method has proven to be two orders of magnitude more computationally efficient compared to FE simulation. A general agreement within 3 percent has been found between the results predicted with the new method, and FE simulations when tested on a number of temperature profiles from an avionic application. The solder joint temperature ranges between +25 and +75°C. Practical implications: – The method can be implemented as part of reliability assessment of electronic packages in the design phase. Originality/value: – The method enables increased accuracy in thermal fatigue life prediction of solder joints. Combined with other failure mechanisms, it may contribute to the accuracy of reliability assessment of electronic packages.