Cite
HARVARD Citation
Chen, G. et al. (2016). An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder. Soldering & surface mount technology. 28 (2), pp. 84-92. [Online].
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Chen, G. et al. (2016). An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder. Soldering & surface mount technology. 28 (2), pp. 84-92. [Online].