A heat-resistant preceramic polymer with broad working temperature range for silicon carbide joining. Issue 1 (January 2018)

• Record Type: Journal Article
• Authors: Tang, Bo; Wang, Mingchao; Liu, Ruiming; Liu, Jiachen; Du, Haiyan; Guo, Anran
• Is Part Of: Journal of the European Ceramic Society. Volume 38:Issue 1(2018)
• Page Start: 67
• Page End: 74
• Publication Date: 2018-01
• Subjects: Heat-resistant -- Temperature range -- Silicon carbide -- Copolymerization -- Fillers; Ceramic materials -- Periodicals; Composite materials -- Periodicals; Matériaux céramiques -- Périodiques; Composites -- Périodiques; Ceramic materials; Composite materials; Periodicals; Electronic journals; 666.05
• DOI: 10.1016/j.jeurceramsoc.2017.08.033
• Languages: English
• ISSNs: 0955-2219

Abstract

Abstract: A room temperature curable heat-resistant adhesive with broad working temperature range was prepared through organic and inorganic modification. The preceramic polymethylsiloxane showed low bonding strength for silicon carbide from 400 °C to 600 °C because of the decomposition of polymer network. So the modification with epoxy resin was used to generate strong blending and copolymerization network which decomposed at higher temperature over 500 °C. The ceramization of active fillers and preceramic polymer compensated the bonding strength with rising temperature, thus eliminating the weak stage from 400 °C to 600 °C. The modification with fillers greatly improved its bonding strength at high temperature over 1000 °C. Consequently, the modified adhesive exhibited outstanding bonding strength tested at room temperature between 9.29 ± 0.56 MPa and 37.28 ± 1.33 MPa after heat-treatment from 25 °C to 1500 °C and the bonding strength directly tested at the temperature from 25 °C to 800 °C over 8.21 ± 0.40 MPa. The adhesive shows the potential to extend the application for engineering ceramic joining.