Easy fabrication of high quality nickel mold for deep polymer microfluidic channels. (9th May 2016)

• Record Type: Journal Article
• Authors: Wong, Ten It; Limantoro, Julian; Fong, Kin Phang; Tan, Christina Yuan Ling; Quan, Chenggen; Sun, Ling Ling; Zhou, Xiaodong
• Is Part Of: Journal of micromechanics and microengineering. Volume 26:Number 6(2016:Jun.)
• Publication Date: 2016-05-09
• Subjects: microfluidics -- mold -- microfabrication -- hot embossing -- bonding; Microelectromechanical systems -- Periodicals; Micromechanics -- Periodicals; 621.38105
• DOI: 10.1088/0960-1317/26/6/065016
• Languages: English
• ISSNs: 0960-1317

Abstract

Abstract: Mass fabrication of disposable microfluidic chips with hot embossing is a key technology for microfluidic chip based biosensors. In this work, we develop a new method of fabricating high quality and highly durable nickel molds for hot embossing polymer chips. The process involves the addition of a thick, patterned layer of negative photoresist AZ-125nxT to a 4″ silicon wafer, followed by nickel electroplating and delamination of the nickel mold. Our investigations found that compared to a pillar mask, a hole mask can minimize the diffraction effect in photolithography of a thick photoresist, reduce the adhesion of the AZ-125nxT to the photomask in photolithography, and facilitate clean development of the photoresist patterns. By optimizing the hot embossing and chip bonding parameters, microfluidic chips with deep channels are achieved.