Cite
HARVARD Citation
Deillon, L. et al. (n.d.). Solid-liquid interdiffusion (SLID) bonding in the Au–In system: experimental study and 1D modelling. Journal of micromechanics and microengineering. p. . [Online].
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Deillon, L. et al. (n.d.). Solid-liquid interdiffusion (SLID) bonding in the Au–In system: experimental study and 1D modelling. Journal of micromechanics and microengineering. p. . [Online].