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HARVARD Citation
Hsieh, L. et al. (2016). Application of multi-fidelity simulation modelling to integrated circuit packaging. International journal of simulation and process modelling. pp. 259-269. [Online].
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Hsieh, L. et al. (2016). Application of multi-fidelity simulation modelling to integrated circuit packaging. International journal of simulation and process modelling. pp. 259-269. [Online].