Cite
HARVARD Citation
Chen, Y. et al. (2016). Analysis of the BGA solder Sn–3.0Ag–0.5Cu crack interface and a prediction of the fatigue life under tensile stress. International journal of fatigue. pp. 216-224. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Chen, Y. et al. (2016). Analysis of the BGA solder Sn–3.0Ag–0.5Cu crack interface and a prediction of the fatigue life under tensile stress. International journal of fatigue. pp. 216-224. [Online].