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HARVARD Citation
Liu, X. et al. (2016). Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging. Scripta materialia. pp. 80-84. [Online].
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Liu, X. et al. (2016). Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging. Scripta materialia. pp. 80-84. [Online].