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HARVARD Citation
Chen, G. et al. (2017). Analytical approach for describing the collapse of surface asperities under compressive stress during rapid solid state bonding. Scripta materialia. pp. 41-44. [Online].
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Chen, G. et al. (2017). Analytical approach for describing the collapse of surface asperities under compressive stress during rapid solid state bonding. Scripta materialia. pp. 41-44. [Online].