Effect of copper-containing universal adhesive bonding in different substrates. (2018)

Record Type:: Journal Article
Title:: Effect of copper-containing universal adhesive bonding in different substrates. (2018)
Main Title:: Effect of copper-containing universal adhesive bonding in different substrates
Authors:: Hanzen, T.A.
Matos, T.P.
Paula, A.M.
Gutiérrez, M.F.
Malaquias, P.
Siqueira, F.S.F.
Cardenas, A.F.M.
Bermudez, J.
Loguercio, A.D.
Abstract:
Is Part Of:: Dental materials. Volume 34(2018)Supplement 1
Journal:: Dental materials
Issue:: Volume 34(2018)Supplement 1
Issue Display:: Volume 34, Issue 1 (2018)
Year:: 2018
Volume:: 34
Issue:: 1
Issue Sort Value:: 2018-0034-0001-0000
Page Start:: e59
Page End:: e60
Publication Date:: 2018
Subjects:: Dentistry -- Periodicals
Dental materials -- Periodicals
617.695
Journal URLs:: http://www.elsevier.com/journals ↗
http://www.sciencedirect.com/science/journal/01095641/ ↗
DOI:: 10.1016/j.dental.2018.08.123 ↗
Languages:: English
ISSNs:: 0109-5641
Deposit Type:: Legaldeposit
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:: British Library DSC - 3553.365800
British Library DSC - BLDSS-3PM
British Library STI - ELD Digital store
Ingest File:: 7700.xml