Micro-scale hole profile measurement using rotating wire probe and acoustic emission contact detection. (July 2016)

• Record Type: Journal Article
• Authors: Elfurjani, Salah; Ko, Junghyuk; Jun, Martin B.G.
• Is Part Of: Measurement. Volume 89(2016:Jul.)
• Page Start: 215
• Page End: 222
• Publication Date: 2016-07
• Subjects: Micro hole -- Acoustic emission -- Hole profile -- Wire probe; Weights and measures -- Periodicals; Measurement -- Periodicals; Measurement; Weights and measures; Periodicals; 530.8
• DOI: 10.1016/j.measurement.2016.04.023
• Languages: English
• ISSNs: 0263-2241

Abstract

Abstract: The development of a new probing method to inspect the inner diameter of micro-scale holes is presented in this paper. This was accomplished by contact detection using acoustic emission with a Ø170 μm rotating wire probe tip. Contact is detected when the rotating probe approaches and impacts the hole's inner surface. The effective diameter of the rotating probe is calibrated by using a high precision grade 0 Mitutoyo gauge block. The wire rotating probe used was fabricated with micro stainless steel wire and micro tubes. The probe's effective diameter was compensated for in the measurement of the hole. The probe was used to measure the diameter and the roundness of micro-scale holes. Probes used in previous publications have different geometry than the probe in this paper and are used almost exclusively for external dimensions. Micro-scale holes of less than 1.0 mm in diameter and 10 mm in depth are successfully measured and the 3D profile is created accordingly. Also, the out-of-roundness values of each level spacing, 50 μm apart in height, are calculated.