A low-temperature fast curing latent catalyst microencapsulated in a porous resin structure. (July 2016)

• Record Type: Journal Article
• Authors: Kamiya, Kazunobu; Suzuki, Noboru
• Is Part Of: International journal of adhesion & adhesives. Volume 68(2016:Jul.)
• Page Start: 333
• Page End: 340
• Publication Date: 2016-07
• Subjects: Aluminum complex -- Microcapsule -- Epoxides -- Cure/hardening; Adhesion -- Periodicals; Adhesives -- Periodicals; Adhésion (Physique) -- Périodiques; Adhésifs -- Périodiques; Adhesie; Kleefstoffen; Adhesion; Adhesives; Periodicals; 668.3
• DOI: 10.1016/j.ijadhadh.2016.04.013
• Languages: English
• ISSNs: 0143-7496

Abstract

Abstract: Low-temperature, fast curing latent catalysts for epoxides were prepared by microencapsulation of aluminum complexes through interfacial and radical polymerization. The resulting resin microcapsules were thermally responsive. Moreover, because the inside of the capsule had a porous structure, a highly active aluminum complex could be forced into the capsule by solvent penetration. The differential scanning calorimetric curve of the encapsulated complex showed an exothermic peak at 100 °C or less. In addition, after a mixture of bisphenol A epoxy resin, the curing catalyst, and triphenyl silanol was stored for 5000 h at 30 °C, the viscosity was only 1.6 times greater than the viscosity just after blending.