A review on reliability of electronic packaging in micro/nano manufacturing. (2015)

• Record Type: Journal Article
• Authors: Yang, Ping; Wang, Yang; Deng, Lin
• Is Part Of: International journal of materials and structural integrity. Volume 9:Number 1/2/3(2015)
• Page Start: 131
• Page End: 143
• Publication Date: 2015
• Subjects: electronic packaging -- component reliability -- dynamic characteristics -- fatigue testing -- vibration loading -- thermal loading -- finite element method -- FEM -- micromanufacturing -- nanomanufacturing -- electronic devices -- nanotechnology; Materials -- Testing -- Periodicals; Strength of materials -- Periodicals; Structural dynamics -- Periodicals; Structural analysis (Engineering) -- Periodicals; 620.112
• Languages: English
• ISSNs: 1745-0055

Abstract

Electronic packaging is a critical part of products such as computers, smart phones, automotive components and other electronic devices. Along with the development of society and economy, the demand for electronic devices and its quality has increased rapidly in recent years. Thus, it is necessary to research the reliability of electronic packaging. This paper presents a review of recent investigations on the reliability of electronic packaging components. The dynamic characteristics and fatigue test under different loading conditions are discussed, including vibration loading, thermal loading and combined loading. Finite element method (FEM) is used frequently in the studies as well as experimental test. Finally, it is significant to emphasise the importance of electronic packaging.