Hexagonal Boron Nitride–Metal Junction: Removing the Schottky Barriers by Grain Boundary. Issue 9 (3rd July 2018)
- Record Type:
- Journal Article
- Title:
- Hexagonal Boron Nitride–Metal Junction: Removing the Schottky Barriers by Grain Boundary. Issue 9 (3rd July 2018)
- Main Title:
- Hexagonal Boron Nitride–Metal Junction: Removing the Schottky Barriers by Grain Boundary
- Authors:
- Ding, Junfei
Ahmed, Dildar
Sun, Huasheng
Chen, Shanbao
Yao, Qiushi
Huang, Chengxi
Deng, Kaiming
Kan, Erjun - Abstract:
- Abstract: Atomically thin hexagonal boron nitride (h‐BN) layers have been used as an ultra‐thin spacer layer for metal–insulator–metal (MIM) structures, which enables a wide range of applications such as nanocapacitors and field‐effect tunneling transistors. Although pristine h‐BN layers, produced by chemical vapor deposition (CVD) methods, are always with ubiquitous grain boundaries (GBs), the contact of such layers with transition metal (TM) has not been explored. Here, we studied h‐BN monolayer with GBs on Ni(111) and Cu(111) surfaces through a comprehensively first‐principles calculation. Our results show that for the free‐standing h‐BN monolayer with GBs, it presents a moiré pattern characteristic and its energy gap is narrowed by about 38%. When h‐BN with GBs is deposited on Ni(111) and Cu(111) surfaces, the GBs containing B‐B pairs are attracted to the TM surface while the GBs with N‐N pairs(GBs‐N) parts are repelled from the surfaces. Interestingly, the calculated Schottky barriers (SBs) for electrons between the h‐BN layer and the TM surfaces almost disappear due to the existence of GB structures. Thus, our results predicted that h‐BN with GBs may form ohmic contact with TM surfaces, which can be used in real electric devices. Abstract : When h‐BN with GBs is deposited on Ni(111) and Cu(111) surfaces, the GBs containing B‐B pairs are attracted to the TM surface. The calculated Schottky barriers (SBs) for electrons between the h‐BN layer and the TM surfaces almostAbstract: Atomically thin hexagonal boron nitride (h‐BN) layers have been used as an ultra‐thin spacer layer for metal–insulator–metal (MIM) structures, which enables a wide range of applications such as nanocapacitors and field‐effect tunneling transistors. Although pristine h‐BN layers, produced by chemical vapor deposition (CVD) methods, are always with ubiquitous grain boundaries (GBs), the contact of such layers with transition metal (TM) has not been explored. Here, we studied h‐BN monolayer with GBs on Ni(111) and Cu(111) surfaces through a comprehensively first‐principles calculation. Our results show that for the free‐standing h‐BN monolayer with GBs, it presents a moiré pattern characteristic and its energy gap is narrowed by about 38%. When h‐BN with GBs is deposited on Ni(111) and Cu(111) surfaces, the GBs containing B‐B pairs are attracted to the TM surface while the GBs with N‐N pairs(GBs‐N) parts are repelled from the surfaces. Interestingly, the calculated Schottky barriers (SBs) for electrons between the h‐BN layer and the TM surfaces almost disappear due to the existence of GB structures. Thus, our results predicted that h‐BN with GBs may form ohmic contact with TM surfaces, which can be used in real electric devices. Abstract : When h‐BN with GBs is deposited on Ni(111) and Cu(111) surfaces, the GBs containing B‐B pairs are attracted to the TM surface. The calculated Schottky barriers (SBs) for electrons between the h‐BN layer and the TM surfaces almost disappear due to the existence of GB structures. … (more)
- Is Part Of:
- Advanced theory and simulations. Volume 1:Issue 9(2018)
- Journal:
- Advanced theory and simulations
- Issue:
- Volume 1:Issue 9(2018)
- Issue Display:
- Volume 1, Issue 9 (2018)
- Year:
- 2018
- Volume:
- 1
- Issue:
- 9
- Issue Sort Value:
- 2018-0001-0009-0000
- Page Start:
- n/a
- Page End:
- n/a
- Publication Date:
- 2018-07-03
- Subjects:
- density functional theory -- grain boundaries -- hexagonal boron nitride -- Schottky barriers -- transition‐metal surfaces
Science -- Simulation methods -- Periodicals
Science -- Methodology -- Periodicals
Engineering -- Simulation methods -- Periodicals
Engineering -- Methodology -- Periodicals
507.21 - Journal URLs:
- http://onlinelibrary.wiley.com/ ↗
- DOI:
- 10.1002/adts.201800045 ↗
- Languages:
- English
- ISSNs:
- 2513-0390
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 0696.935575
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 7452.xml