Thermal performance of a PCB channel heat sink for LED light bulbs. (October 2015)

• Record Type: Journal Article
• Authors: Jang, Daeseok; Park, Seung-Jae; Lee, Kwan-Soo
• Is Part Of: International journal of heat and mass transfer. Volume 89(2015:Oct.)
• Page Start: 1290
• Page End: 1296
• Publication Date: 2015-10
• Subjects: LED bulb -- Light-emitting diode (LED) lighting cooling -- Printed circuit board (PCB) heat sink -- Natural convection; Heat -- Transmission -- Periodicals; Mass transfer -- Periodicals; Chaleur -- Transmission -- Périodiques; Transfert de masse -- Périodiques; Electronic journals; 621.4022
• DOI: 10.1016/j.ijheatmasstransfer.2015.06.027
• Languages: English
• ISSNs: 0017-9310

Abstract

Highlights: The thermal performance of PCB as a heat sink for LED bulbs is analyzed. The cooling performance is improved by arranging parallel PCB as a channel. The heat transfer is optimized by balancing flow rates on external and internal PCB. The orientation effect on PCB channel was found to be 10% less than reference design. Abstract: In this study, the thermal performance of the printed circuit board (PCB) as a heat sink for the light-emitting diode (LED) bulb is analyzed. Cooling air is drawn through the bottom inlet of a case and exchanges heat from a vertically aligned PCB acting as a heat sink fin. The air then exits through a top outlet. Cooling performance is improved by arranging parallel PCBs to form a channel. Heat transfer is optimized by balancing cooling airflow rates on external and internal PCB surfaces, thereby reducing thermal resistance by 30% compared to previous designs. Cooling performance according to installation angle is investigated. The orientation effect on this channel design is determined to be 10% less than that of the reference design. Finally, the effect of PCB channel cooling performance on the LED bulb's life span is analyzed and shown to be 40% longer than that of the existing geometry.