Functionalization and densification of inter-bundle interfaces for improvement in electrical and thermal transport of carbon nanotube fibers. (August 2016)

• Record Type: Journal Article
• Authors: Qiu, Lin; Wang, Xiaotian; Tang, Dawei; Zheng, Xinghua; Norris, Pamela M.; Wen, Dongsheng; Zhao, Jingna; Zhang, Xiaohua; Li, Qingwen
• Is Part Of: Carbon. Volume 105(2016)
• Page Start: 248
• Page End: 259
• Publication Date: 2016-08
• Subjects: Carbon -- Periodicals; Carbone -- Périodiques; Koolstof; Toepassingen; Electronic journals; 546.681
• DOI: 10.1016/j.carbon.2016.04.043
• Languages: English
• ISSNs: 0008-6223

Abstract

Abstract: Electrical and thermal management in nanodevices by means of carbon nanotube is highly promising. One main challenge toward CNT-based nanoscale electrical and thermal management devices is the development of effective strategies for reducing the bundle–bundle interface resistance. Here we report a novel strategy, based on the densification of CNT bundles and the functionalization of inter-bundle interfaces for effectively enhanced interfacial electrical and thermal transport. The densification is realized by utilizing the local electrostatic cohesion; and the functionalization is realized by the interface-decorated functional groups. Experiments and theoretical analysis demonstrated obviously enhanced interfacial electrical and thermal conductance originates from: (1) local Coulomb electrostatic cohesion between CNT bundles due to surface-induced dipole moments. This effect can promote both electrical and thermal conductance nearly 2.8 times higher than non-functionalized counterpart. (2) Increased interfacial electron transport channels and thermal vibrations due to surface-decorated functional groups. This effect can bring about up to 75% and 95% improvement for thermal and electrical conductance, respectively. This study provides a new methodology for tunable operation of electrical and thermal properties at inter-bundle interfaces and guidance for design of CNT-based electrical and thermal management devices.