Deformation and texture evolution of OFHC copper during dynamic tensile extrusion. (1st May 2015)
- Record Type:
- Journal Article
- Title:
- Deformation and texture evolution of OFHC copper during dynamic tensile extrusion. (1st May 2015)
- Main Title:
- Deformation and texture evolution of OFHC copper during dynamic tensile extrusion
- Authors:
- Hörnqvist, M.
Mortazavi, N.
Halvarsson, M.
Ruggiero, A.
Iannitti, G.
Bonora, N. - Abstract:
- Abstract: During dynamic tensile extrusion (DTE) the material is subjected to a complex deformation history, including high strain rates, large strains and elevated temperatures. This technique provides unique means to explore material performance under extreme conditions. In this work, the microstructural evolution of 99.98% commercially pure copper during the DTE test was investigated by means of electron backscatter diffraction (EBSD). The investigation was focused on the segment of the extruded jet that remained in the die, since numerical simulation showed that material points along the longitudinal axis of such segment correspond to different stages of a common temperature compensated deformation history. Therefore, post mortem microstructure information extracted at different locations along the center line is equivalent to in situ real-time measurement during the deformation process. EBSD investigations along the center line showed a progressive elongation of the grains, and an accompanying development of a strong 〈0 0 1〉 + 〈1 1 1〉 dual fiber texture. Meta-dynamic discontinuous dynamic recrystallization (DRX) occurred at larger strains, and it was demonstrated that nucleation occurred during straining, while subsequent grain growth took place during post-deformation cooling in the die. According to strain energy minimization arguments, the recrystallization resulted in an increased 〈0 0 1〉 texture component. The critical strain for recrystallization was wellAbstract: During dynamic tensile extrusion (DTE) the material is subjected to a complex deformation history, including high strain rates, large strains and elevated temperatures. This technique provides unique means to explore material performance under extreme conditions. In this work, the microstructural evolution of 99.98% commercially pure copper during the DTE test was investigated by means of electron backscatter diffraction (EBSD). The investigation was focused on the segment of the extruded jet that remained in the die, since numerical simulation showed that material points along the longitudinal axis of such segment correspond to different stages of a common temperature compensated deformation history. Therefore, post mortem microstructure information extracted at different locations along the center line is equivalent to in situ real-time measurement during the deformation process. EBSD investigations along the center line showed a progressive elongation of the grains, and an accompanying development of a strong 〈0 0 1〉 + 〈1 1 1〉 dual fiber texture. Meta-dynamic discontinuous dynamic recrystallization (DRX) occurred at larger strains, and it was demonstrated that nucleation occurred during straining, while subsequent grain growth took place during post-deformation cooling in the die. According to strain energy minimization arguments, the recrystallization resulted in an increased 〈0 0 1〉 texture component. The critical strain for recrystallization was well predicted from a power-law dependence on the Zener–Hollomon parameter, including grain size dependence and a temperature dependent activation energy. In addition, it was shown that 〈0 0 1〉 and 〈1 1 1〉oriented grains develop different dislocation substructures during straining, exhibiting elongated cells/micro-bands and typical cell structures, respectively. The present results also confirm that dynamic tensile ductility increases with decreasing initial grain size as a result of grain refinement and lowering of dislocation and twin densities during DRX. … (more)
- Is Part Of:
- Acta materialia. Volume 89(2015)
- Journal:
- Acta materialia
- Issue:
- Volume 89(2015)
- Issue Display:
- Volume 89, Issue 2015 (2015)
- Year:
- 2015
- Volume:
- 89
- Issue:
- 2015
- Issue Sort Value:
- 2015-0089-2015-0000
- Page Start:
- 163
- Page End:
- 180
- Publication Date:
- 2015-05-01
- Subjects:
- Dynamic tensile extrusion -- Copper -- DRX -- EBSD -- Texture
Materials -- Periodicals
Materials science -- Periodicals
Materials -- Mechanical properties -- Periodicals
Metallurgy -- Periodicals
Chemistry, Inorganic -- Periodicals
620.112 - Journal URLs:
- http://www.sciencedirect.com/science/journal/13596454 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.actamat.2015.01.053 ↗
- Languages:
- English
- ISSNs:
- 1359-6454
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 0629.920000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 7314.xml