Cite
HARVARD Citation
Yao, Y. et al. (2015). A continuum damage mechanics-based unified creep and plasticity model for solder materials. Acta materialia. pp. 160-168. [Online].
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Yao, Y. et al. (2015). A continuum damage mechanics-based unified creep and plasticity model for solder materials. Acta materialia. pp. 160-168. [Online].