Investigation into the application of low melting temperature alloys as wet thermal interface materials. (June 2015)

• Record Type: Journal Article
• Authors: Roy, Chandan K.; Bhavnani, Sushil; Hamilton, Michael C.; Johnson, R. Wayne; Nguyen, Jonathan L.; Knight, Roy W.; Harris, Daniel K.
• Is Part Of: International journal of heat and mass transfer. Volume 85(2015:Jun.)
• Page Start: 996
• Page End: 1002
• Publication Date: 2015-06
• Subjects: Low melt alloys -- Thermal interface material -- Thermal resistance -- Thermal cycling -- Dewetting; Heat -- Transmission -- Periodicals; Mass transfer -- Periodicals; Chaleur -- Transmission -- Périodiques; Transfert de masse -- Périodiques; Electronic journals; 621.4022
• DOI: 10.1016/j.ijheatmasstransfer.2015.02.029
• Languages: English
• ISSNs: 0017-9310

Abstract

Abstract: The application of low melt alloys (LMAs) containing In, Ga, Sn, and Bi as compliant high performance thermal interface material (TIM) is investigated. The investigation described herein involves in situ thermal performances of the LMAs as a function of applied pressure and interface temperature, performance evaluation after accelerated life cycle testing, and guidelines to improve the cycle life. Testing methodologies follow ASTM D5470 protocols, and measurements are validated by testing well established, commercially available TIMs and comparisons are made to values reported in open literature as well as manufacturers' data. Measurement shows that LMAs can offer thermal interfacial resistances as low as 0.005 cm 2 °C/W, and their performance is highly contingent upon the quality of the mating surfaces. The issue of LMA containment and dewetting are discussed along with the solutions to mitigate them.